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ECAM's precision, efficiency, and material versatility is transforming manufacturing across industries, enabling countless game-changing applications.
High Density Cooling
Fabric8Labs partners with semiconductor, photonics, and optical interconnect innovators to deliver liquid cooling hardware engineered for the most demanding AI, ML, and custom silicon workloads.
Our electrochemically manufactured solutions feature micron-scale precision and application-specific geometries that can double thermal performance versus traditional CPU/GPU cold plates — enabling higher TDPs, improved reliability, and design freedom across the compute stack.
From next-generation GPUs to high-density optical modules, Fabric8Labs ECAM technology is proven at scale — including a recently demonstrated 3.5 kW cold plate with Wiwynn for AI infrastructure.
Explore Our Cooling Solutions:
- Single-Phase Liquid Cooling — High-efficiency, drop-in cold plates with minimal pressure drop and custom power map optimization.
- Custom Silicon Cooling — Tailored cold plates that match non-uniform die layouts for consistent thermal performance.
- Two-Phase Cooling — Advanced capillary microchannel designs for stable, high-heat-flux operation.
- Immersion Cooling — Direct-to-silicon boiling plates for maximum thermal headroom and reliability.
CUSTOM POWER MAP OPTIMIZED COOLING SOLUTION
MAXIMIZE PERFORMANCE
LOWER TCO
Custom cooling solutions
ECAM Enables Best-In-Class Liquid Cooling
Unlock Mass-Customized, High-Performance Cooling with ECAM. Rapidly deploy optimized thermal solutions tailored for your most demanding high TDP applications. Get the technical data and performance curves – download our B200 case study.
WIRELESS COMPONENTS
Our technical experts collaborate with customers to produce AI-optimized 3D antennas, low loss RF filters and waveguides for high frequency (Ka through Y band) applications that provide higher Gain, HPBW, and VSWR performance.
- Pure Metal Deposition At Room Temperature
- Printing Direct To Circuit Boards
- High Resolution Printing Of Features Optimized for mmWave Applications
Improved axial ratio and UWB performance
LOW SURFACE ROUGHNESS
CMMC LEVEL II CERTIFIED
POWER ELECTRONICS
Our technical experts collaborate with customers to produce ceramic-based substrates for power electronics applications with pure copper printed at customized thicknesses for power and signal traces, as well as integrated thermal management structures.
- Print Directly Onto Ceramics (SiN, Al2O3, etc.)
- Stress-free, High Conductivity Copper Structures Printed At Room Temperature
- Integrated Thermal Management Features On DBC Substrates To Remove TIM
DIRECT PRINT TO REMOVE TIM
Reduce overall package size
IMPROVED THERMAL
PERFORMANCE
EMERGING APPLICATIONS
Our technical experts collaborate with customers to produce products for a wide range of conductive materials for catalysis, medical devices, connectors and micro-mechanical components.
ECAM’s exceptional printing resolution surpasses traditional techniques and is crucial for intricate micro-medical components. Unlike traditional methods that require high temperature processing, ECAM builds at room temperature. The result, no thermal stresses and no warping, which is essential for maintaining the precise structures for electronics and micro medical components.
- High Resolution & Geometric Freedom
- Room Temperature Deposition Without Post-print Deformation
- Wide Range of Alloy-systems Available
Increased surface area
Combine geometries for optimized performance
