AI chips are pushing heat flux levels, overwhelming conventional cooling methods. This showcase explores how electrochemical additive manufacturing (ECAM) can be used to enhance thermal performance within existing infrastructure, from direct-to-chip single-phase cooling, through to direct-to-silicon immersion. Join this session to:
- Discover how to target hotspots and direct flow to flatten temperature variance
- Cut energy use and improve PUE to deliver immediate ROI
- Learn how ECAM-enabled cooling can extend hardware life reducing throttling incidence
- Avoid contaminants seeping into cold plate fins to maintain performance
Watch the full tech showcase here.
