Single-Phase Liquid Cooling

Pushing the Limits of Liquid Cooling

Single-phase liquid cooling remains the workhorse of today’s high-density compute environments—but tomorrow’s workloads demand more. As AI, custom silicon, and next-gen GPUs push power densities higher, your thermal hardware must deliver greater performance, higher efficiency, and faster adaptability than traditional cold plates can achieve.

At Fabric8Labs, we build next-generation cold plates with Electrochemical Additive Manufacturing (ECAM)—delivering:

  • Best-in-Class Thermal Performance: Proven <0.01 °C/W with minimal pressure drop, even in dense, high-TDP hardware.

  • True Design Freedom: Every channel, fin, and manifold optimized to your exact power map—no tooling constraints.

  • Scalability Without Compromise: From prototype to millions of units, ECAM delivers consistent quality and lowest TCO at any volume.

Cooling with ECAM

ECAM redefines what’s possible in single-phase thermal management. Instead of machining away material or bonding assemblies, ECAM grows pure copper directly from the atomic level—unlocking internal features, sharp corners, and complex geometries impossible to produce with legacy manufacturing.

What Sets ECAM Apart:

  • Room-Temperature, Water-Based Process – Compatible with high-performance substrates and materials, including direct-to-silicon printing.

  • Micron-Scale Channel Resolution – Fully custom geometries deliver uniform die temperatures and hotspot elimination.

  • Monolithic Copper Construction – No bonded joints or thermal interface layers, reducing leak risk and improving long-term reliability.

  • Rapid Digital Customization – Update designs as hardware evolves without tooling delays—accelerating innovation cycles.

custom single-phase cooling insert

Download the White Paper

Looking to dive deeper into how ECAM-enabled cold plates outperform traditional solutions?
Our technical white paper covers thermal performance data, real-world use cases, and design benchmarks.

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ECAM: Quantified Savings

Modeling $70M/year in Energy Savings at Hyperscale

  • Lower cooling energy per watt: ECAM cold plates cut total energy spend by enabling higher water temperatures and lower thermal resistance.

  • Higher allowable water temps: Run facility water at 29.7°C—nearly 5°C higher than legacy cold plates—while maintaining safe junction temperatures and eliminating thermal throttling.

  • Reduced pump energy and maintenance: Optimized flow paths and lower pressure drop drive down OPEX, simplify maintenance, and extend equipment life.

  • Immediate, facility-scale ROI: $70M+ annual savings in a 500 MW data center, modeled using The Green Grid TCO framework.

The ECAM Business Case

Discover how ECAM cold plates unlock $70M+ in annual energy savings at hyperscale—validated by The Green Grid TCO framework. This paper details the operational, financial, and technical gains that set a new benchmark for data center cooling ROI.

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Prototype to Production

The ECAM platform supports the complete photonics development cycle, from early design validation to high-volume manufacturing:

  • Rapid digital prototyping – Move from concept to functional hardware in days, enabling fast iteration and design refinement without tooling delays. This agility allows engineers to test multiple geometries in parallel and quickly converge on the optimal thermal solution.

  • Volume manufacturing – Produce high-precision inserts at scale with consistent geometry, material quality, and thermal performance. ECAM’s parallelized, room-temperature process ensures that scaling output does not compromise part accuracy or reliability, making it ideal for both niche and mass-market photonics applications.

  • Supply chain integration – Deliver fully finished, ship-to-line inserts ready for assembly by your preferred cold plate or optical module provider, ensuring seamless adoption into existing manufacturing workflows. Fabric8Labs can align production schedules, packaging, and quality assurance protocols with your current suppliers to accelerate deployment.

Proven Design Strategies

Fabric8Labs’ ECAM technology delivers cooling solutions engineered for the most demanding semiconductor and photonics applications—whether it’s GPUs in AI data centers, or high-power laser diodes and optical transceivers in advanced communication systems. Every design is optimized for both peak thermal performance and scalable manufacturability.

  • Power-Map Optimization – ECAM enables microchannel geometries precisely matched to each device’s heat flux profile, targeting cooling capacity exactly where GPUs, AI accelerators, or photonic components generate the most heat.
  • Hybrid Baseplate Integration – Merge conventionally machined surfaces for mechanical or optical alignment with ECAM-printed microstructures for heat removal, creating a single assembly that meets both precision alignment and extreme cooling requirements.
  • Reliability at Scale – Monolithic, high-purity copper features reduce leak paths, resist fouling, and deliver stable performance over extended operating lifetimes—critical for hyperscale deployments and mission-critical optical networks.

ECAM Enables Best-In-Class Liquid Cooling

Unlock Mass-Customized, High-Performance Cooling with ECAM. Rapidly deploy optimized thermal solutions tailored for your most demanding high TDP applications. Get the technical data and performance curves – download our B200 case study.

Download Case Study

Go to Market
with ECAM